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Models: GP200

GP200 Metal Sealed Mass Flow Controllers

All of the performance. None of the limitations.

GP200 Series is the first fully pressure-insensitive pressure-based mass flow controller (P-MFC) designed specifically for advanced Etch and Deposition processes in semiconductor manufacturing.

The GP200 Series P-MFC features a patented architecture that overcomes the limitations of conventional P-MFCs to provide the most precise process gas delivery even when delivering low vapor pressure process gases. It includes several unique design aspects, including an integrated differential pressure sensor coupled with a downstream valve architecture enabling the most precise process gas delivery over the widest range of operating conditions in the industry.

Since GP200 Series supports such a broad range of process conditions, it can be used as a drop-in replacement and upgrade for many traditional P-MFCs and thermal MFCs. It reduces the complexity and cost of ownership of the gas delivery system because it eliminates the need for components such as pressure regulators and transducers.

Features
  • True differential pressure measurement
  • Lower inlet pressure operation
  • Downstream valve architecture
  • Matched transient response
  • Zero Leak-by Control Valve
  • MultiFloTM technology offers unparalleled flexibility—one device can be programmed for thousands of different gas and flow range configurations without removing the MFC from the gas line or compromising accuracy
  • Local display indicates flow, temperature, pressure and network address
  • DeviceNetTM, EtherCAT®, RS-485 L-Protocol and analog interfaces
Applications
  • Semiconductor manufacturing
  • Etch
  • Chemical Vapor Deposition (CVD)
  • Gas flow control applications that require a high purity all-metal flow path
Benefits
  • By removing the requirement to match and compensate two separate pressure transducers, the GP200 differential pressure technology reduces measurement uncertainty for enhanced accuracy, repeatability and drift performance.
  • Safer fab operation at lower inlet pressures is now achievable with a P-MFC due to the GP200 differential pressure sensor that is specifically optimized for low differential pressure measurement.
  • The downstream valve architecture ensures accuracy is independent of downstream pressure, enabling flow delivery into pressures as high as 1200 Torr. The fast closing valve addresses non-productive recipe wait times, or "tail effects," seen in upstream MFC valve designs that require additional time to bleed down their internal volume of gas.
  • Ultra-fast, highly repeatable ascending and descending flow stabilization time enables tighter process control in advanced high cycle Deposition and Etch processes.
    100X improvement in valve shut-down
  • With MultiFloTM, MFC full scale flow range can be re-scaled down typically by a factor of 3:1 with no impact on accuracy, turndown or leak by specifications, for optimum process and inventory flexibility
  • Convenient user display and independent diagnostic/service port aids device installation, monitoring and troubleshooting

Pressure-based Mass Flow Controller - The Principle of Operation
Part 2: Pressure-based Mass Flow Meter for Advanced Semiconductor Manufacturing
How a Mass Flow Meter Addresses Flow Bursts with Zero Leak-by Valve Technology
Type of Media Gas
Flow Measuring Principle Pressured-based (P-MFC)
Flow Range 3 sccm - 50,000 sccm
Accuracy Range Zero Leak Valve: <±1% S.P. (5-100% F.S.), <±0.05% F. S. (0.5-5% F.S.), Metal Seal Valve: <±1% S.P. (5-100% F.S.), <±0.05% F. S. (2-5% F.S.)
Turndown Ratio Zero Leak Valve: 0.5 - 100% F.S., Metal Seal Valve: 2 - 100% F.S.
Repeatability < ±0.15% S.P.
Max Pressure 150 psi
Operating Temperature 10°C - 60°C
Measure/Control Measure & Control (Controller)
Max Flow 50000 sccm
Max Operating Pressure 10 bar
Max Temperature 60 celsius
Seal Option Metal
Accuracy (% of rate) ±1.0%
Connectivity Analog (0–5 V), DeviceNet, EtherCAT, RS485
Filename
File Type
Documents by Language
Data Sheet - GP200 Series
PDF
Installation and Operation Manual - GP200 Series
PDF
DeviceNet™ Supplemental Manual - GP200 Series
PDF
EtherCAT® Supplemental Manual - GP200 Series
PDF
RS485 L-Protocol Supplemental Manual - GP200 Series
PDF

Use the following guide (model code information from data sheet) to translate the CAD configurations available below. If you need assistance or can’t find what you’re looking for, please contact Applications Engineering or your local Brooks Instrument representative.

Example: GP200 - Fitting - Communications - STEP