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GF135 Series Real-Time Flow Error Detection Metal Sealed Thermal Mass Flow Controllers

Performance and intelligence.
Models GF135

Keep critical flow processes on-target and maximize throughput with the GF135 Advanced Diagnostics Pressure Transient Insensitive (PTI) mass flow controller. The world’s first “smart” mass flow controller is a true game changer: It performs integral rate-of-decay flow measurement without stopping the flow of process gas. It allows semiconductor manufacturers to verify process gas accuracy, check valve leak-by and monitor sensor stability in real time without removing the flow controller from the gas line.

Combined with an all-metal wetted flow path, ultra-fast settling times and industry-leading process gas accuracy, the GF135 PTI MFC has the potential to transform the productivity and throughput rates for a wide range of deposition processes.


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  • Long-term zero stability of <±0.5% full scale per year
  • Ultra-fast settling times: <300 ms - <400 ms
  • Full-scale flow rates: 3 sccm to 5 slm
  • Ultra-high purity flow path - 4µ inch Ra surface finish
  • Embedded real-time flow error detection and trending using Rate of Decay (ROD) techniques
  • Enhanced process gas accuracy - up to three times improvement - through advanced gas modeling optimized through actual gas testing
  • Third generation pressure transient insensitivity (PTI) technology
  • High visibility, electronically rotatable LCD display provides local indication of flow, temperature, pressure and network address
  • DeviceNet™, RS-485 and analog interfaces


  • Real-time flow error detection enables faster adjustments to flow deviations and supports wafer yield improvement
  • Sensor stability tracking improves system uptime by supporting predictive maintenance
  • Valve leak-by tracking helps minimize first wafer effects
  • Enhanced process gas accuracy meets process gas chemistry control challenges at 10 nm
  • Market leading flow settling time reduces non-productive flow stabilization steps, supporting advanced 3D device processing
  • Enhance pressure insensitivity delivers superior process gas control for enhanced etch and deposition control
  • Corrosion-resistant Hastelloy® sensor provides unmatched long-term sensor stability ensuring maximum yield and throughput
  • Drop-in replacement for surface-mount and VCR MFCs is an easy upgrade for critical gas lines on existing systems


  • Semiconductor advanced etch tools
Product Type
Mass Flow Controller

Real-Time Flow Error Detection

Advanced Diagnostics

Flow Range (Full Scale Capacity)

3 sccm - 5 slm (N2 Eq.)

Pressure Transient Insensitivity

< 1% S.P. for up to 5 psi/sec upstream press. spike


±1% S.P. 10-100% F.S.

±1% S.P. plus ±0.04% F.S. 2-10% F.S.

< ±0.15% S.P.

Included in accuracy

Response Time

<300 ms (<860 sccm N2 equivalent)

<400 ms (861-5000 sccm N2 equivalent)

(to within ±2% FS)

<300 ms (<860 sccm N2 equivalent)

<400 ms (861-5000 sccm N2 equivalent)

(to within ±2% FS)

<300 ms (<860 sccm N2 equivalent)

<400 ms (861-5000 sccm N2 equivalent)

(to within ±2% FS)

Multi-Gas & Range Configurability

Control Range

1 - 100%

Valve Shut Down

< 0.5% of F.S. N2

Zero Stability
< ±0.5% F.S. per year
Flow Temperature Coefficient

Span: 0.05% S.P./°C

Zero: 0.005% F.S./°C

Seal Material


Level of Purity / Surface Finish
4µ inch Ra
Wetted Materials

SEMI F20 HP Compliant


Hastelloy C-22

316L Stainless Steel

304 Stainless Steel


Valve Options

Normally Closed

Max Temperature


Differential Pressure Range

3-860 sccm = 7-45 psid

861 - 5000 sccm = 10-45 psid

*Typical pressure drops. Contacts Brooks Technical Support for more information.

Max Pressure

100 psia max

Leak Integrity
1x10-10 atm cc/sec He
Diagnostics & Display
Diagnostic Capability

Status Lights

MFC Health

Network Status


Sensor Output, Control Valve Output, Over Temperature, Power Surge/Sag, Network Interruption, Sensor Drift, Flow Error, Valve Leak

Diagnostic / Service Port

RS485 via 2.5mm jack


Top Mount Electronically Rotatable Integrated LCD

Viewing Angle: Fixed

Viewing Distance: 10 feet

Units Displayed: Flow (%), Temp (°C), Pressure (psia, kPa)

Resolution: 0.1 (unit)

Analog Communication

0-5 Vdc

Digital Communication



Electrical Connection

Analog/RS485 via 9-Pin "D" connector

DeviceNet™ via 5-Pin "M12" connector

Power Supply / Consumption

Analog/RS485: 6 Watts max @ ±15 Vdc (±10%) or +24 Vdc (±10%)

DeviceNet™: 545 mA max @ +11-25 Vdc, 250 mA max @ 24 Vdc

(Under typical operating conditions)


EC Directive 2004/108/EC

CE: EN61326-1: 2006 (FCC Part 15 & Canada IC-subset of CE testing)

Environmental Compliance

RoHS Directive (2011/65/2006)

REACH Directive EC 1907/2006

Flow Range (Full Scale Capacity) 3 sccm - 5 slm (N2 Eq.)
Response Time

<300 ms (<860 sccm N2 equivalent)

<400 ms (861-5000 sccm N2 equivalent)

(to within ±2% FS)

Gases Supported

N2, O2, Ar, H2, SF6, NH3, CO2, Cl2, HBr, NF3, CF4, CH3F, CH2F2,

SiCl4 (@ 100 Torr), C4F6-q (@ 800 Torr), C4F8 (@ 1200 Torr),

N2O, CHF3, SiH2Cl2, C5F8, He

Rate-of-Decay Performance ROD by default is disabled/off. It should not be enabled until after the MFC is installed and properly commissioned.
Surface Finish 4µ inch Ra
FilenameFile TypeDocuments By Language
Data Sheet pdf English
Installation & Operation Manual pdf English
DeviceNetâ„¢ Supplemental Manual - GF100 Series pdf English
RS485 L-Protocol Supplemental Manual - GF100 Series pdf English
GF135 Series Software
Commissioning software that provides users with a simple means to create a performance baseline during initial installation of the MFC.