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Physical Vapor Deposition
Physical vapor deposition or sputtering is commonly used for creating films of material, often metal, on a substrate. Plasma is used to remove and accelerate the atoms of interest toward the target placed in a vacuum chamber. Mass flow controllers are used to control the gas flow to the chamber. Our advanced control valve PID controller can eliminate overshoot that can quench and destabilize the plasma.The Brooks 4800 Series is a great solution for controlling argon in a plasma process. This product has a very fast response to set point without overshoot along with having a very small footprint. The optional local operator interface allows for easy stand alone installation and a variety of options well suited to these applications.
Other Application Notes
- Basic Flow Control
- Catalyst Research
- Heat Treating, Cutting/Welding, and other Thermal Processes
- Vacuum Processes
- Bioreactors
- Precision Coatings
- Chemical Injection/Dosing Systems
- Process Analyzer Sample Flow
- Rotating Equipment
- Fuel Cell Test Stand
- Device Testing and Metrology
- Level Measurement
- Physical Vapor Deposition
- Chemical Vapor Deposition, including MOCVD
- Transparent Conducting Oxides
- Polysilicon and Crystal Pulling
- Spray Coatings
